Barrier layers
Technical, highly ductile nickel layers suitable for stamping, for switch, telephone and apparatus engineering. Plating thickness up to approx. 5 µm. Nickel used as a barrier layer against diffusion processes, e.g. in soldering technology.
OTTO BRENSCHEIDT GmbH & Co. KG
Frankfurter Str. 18
D-59846 Sundern

Phone: +49 2933 9022-0
Fax: +49 2933 9022-22

info@brenscheidt.com
Copper [Cu]

Copper-plated wire

Iron wires with a strong copper plating. Barrier and carrier layer for further electroplating. Aids drawing in the case of special alloys.

Dimensional range: 0.200-1.700 mm Ø
Packaging: Spools or coils

Please feel free to contact us for a quote. here 
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