OTTO BRENSCHEIDT - electroplated wire and strip

Measurement technology

Measurement of the plating thickness by way of coulometrics or by X-ray spectrometric examination
Optical evaluation of the surface under the microscope
Wrapping, torsion or bending test to determine adhesive strength
Determining the non-porosity of a layer using the polysulfide method or according to Geoffroy de Lore
Determining diameter by micrometer screw, analysis scale or laser measurements
Determining strength and flexibility using tensile tests
Assessment of soldering suitability with solder bath, solder ball test or meniscograph, also after ageing in a drying oven or in water vapour