Soldering technology
For top quality soldering and as pure tin, naturally compliant with RoHS and WEEE.
Whiskers
Whisker formation can be a problem during tin plating of copper wires.

Barrier layers
Technical, highly ductile nickel layers suitable for stamping, for switch, telephone and apparatus engineering. Plating thickness up to approx. 5 µm. Nickel used as a barrier layer against diffusion processes, e.g. in soldering technology.
OTTO BRENSCHEIDT GmbH & Co. KG
Frankfurter Str. 18
D-59846 Sundern

Phone: +49 2933 9022-0
Fax: +49 2933 9022-22

info@brenscheidt.com
Tin [Sn] and tin lead [SnPb]

The spread of electricity in the 19th century led to a huge rise in the demand for cable conductors. At the time, it proved difficult to find appropriate insulating materials. Latex, rubber or rubber-based materials were mostly used, sometimes reinforced by textiles. In practice, these materials were very unpopular, as the copper reacted with the sulphurous components of the rubber coating, which made removal of the coating considerably more difficult.

However, prior tin-plating of the copper wire before insulation was an effective way of preventing this process, allowing for simple and neat removal of the synthetic materials. Thus, tin-plating was soon universally accepted as the favoured surface for copper wires. In addition, tin-plated wire showed better solderability as well as good lubricating properties during drawing.

With the development of PVC-based insulators in recent times, which no longer react with copper wire, tin plating lost its high importance in the cable industry. Despite this, tin-plated wire is still regarded as a premium product and is used for military and other critical applications. Although for the most part, bare copper wires are used in the cables of the automotive industry, tin-plated wires are still used in safety-critical areas, e.g. in airbags.

Tin-plating is carried out in two different ways. On the one hand, the wire can be run through liquid tin. The tin is deposited on the cold surface. We do not offer this type of tin-plating; as depositing parameters are difficult to monitor, leading to irregular coatings that do not meet today’s customers’ requirements. Furthermore, this method is expensive and has a low throughput.

On the other hand, plating can be carried out using conventional electro-plating technology. Tin is anodically dissolved in electrolytes (acid electrolytes in most cases) and is deposited cathodically on the material. A further advantage of this method is the high level of purity of the tin plating. Requirements with regards to layer quality have in part become considerably higher, especially against the backdrop of RoHS and WEEE provisions.

Tin-plated wire
Electrolytically tin-plated round, square and other profiled wires for all areas of electrical engineering including highly automated soldering processes. Also suitable as a protection when processing aggressive plastics. Also with nickel or copper barrier layer.

Dimensional range: 0,130-3,000 mm Ø and profiles
Packaging: Spools or coils


Mixed tin-plated wire (SnPb 95/5)
Alternative to pure tin-plating; excellent soldering properties, including in the long-term, whisker proof due to the lead content of the alloy. Also with nickel or copper barrier layer.

Dimensional range: 0.130-2.000 mm Ø
Packaging: Spools

Tin-plated strips

Galvanically tin-plated strips suitable for soldering, with special pre-treatment for stamping, bending and drawing of electro technical and electronic components, plating thickness up to 12 µm. Also with nickel barrier layer.

Strip width: up to 250 mm
Strip thickness: 0.150-1.800 mm


Please feel free to contact us for a quote. here 
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